ADHESIVE TAPE FOR LASER DICING

• Main Authors: SUZUKI KYOICHI, SHIRAISHI YURI
• Format: Patent
• Language: English; Japanese
• Published: 19.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide an adhesive tape for laser dicing which is capable of performing dicing without damaging and cutting fibers of a mesh substrate even on a high-energy laser processing condition in laser dicing in which a laser is guided by a water jet, also prevents chip scattering or chip defects caused by a water flow and further prevents an adhesive layer from being transferred to a chip side (paste from remaining) when picking up an individualized chip.SOLUTION: The present invention relates to an adhesive tape for laser dicing comprising a substrate and an adhesive tape configured by successively laminating an adhesive layer and a separator film on one surface of the substrate. The adhesive layer consists of an adhesive composition containing at least a (meth)acrylic acid ester copolymer, a radiation-polymerizable initiator, a radiation-polymerizable compound, an isocyanate-based cross-linking agent and a hydroxyl group containing acrylic resin, and light transmittance in a wavelength of 532 nm is 85% or more.SELECTED DRAWING: Figure 1 【課題】レーザーがウォータージェットでガイドされるレーザーダイシングにおいて、高エネルギーのレーザー加工条件でもメッシュ基材の繊維が損傷、切断せずにダイシングができ、水流によるチップ飛びや、チップの欠陥もなく、さらに個片化したチップのピックアップ時に粘着剤層がチップ側へ転着（糊残り）しないレーザーダイシング用粘着テープを提供すること。【解決手段】基材と、前記基材の一方の面の上に粘着剤層とセパレータフィルムとを順次積層した粘着テープであり、前記粘着剤層は少なくとも（メタ）アクリル酸エステル共重合体、放射線重合性化合物、放射線重合開始剤、イソシアネート系架橋剤、水酸基含有アクリル樹脂、を含む粘着剤組成物からなり、且つ、波長５３２ｎｍにおける光線透過率が８５％以上のレーザーダイシング用粘着テープとする。【選択図】図１