RESIN COMPOSITION

To provide a resin composition which is curable in short time at low temperature around room temperature, prevents contamination in the periphery by resin volatile, and is suitable as a one-pack type adhesive for manufacturing an electronic component.SOLUTION: A resin composition contains at least o...

Full description

Saved in:
Bibliographic Details
Main Authors IWATANI KAZUKI, ARAI FUMINORI
Format Patent
LanguageEnglish
Japanese
Published 14.06.2023
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:To provide a resin composition which is curable in short time at low temperature around room temperature, prevents contamination in the periphery by resin volatile, and is suitable as a one-pack type adhesive for manufacturing an electronic component.SOLUTION: A resin composition contains at least one kind of a 2-methylene-1,3-dicarbonyl compound and at least one kind of a tertiary amine compound. Each of the 2-methylene-1,3-dicarbonyl compound has at least one structural unit represented by the following formula, and has a molecular weight of 180-10,000. Each of the tertiary amine compound is represented by formula: [NR(CH3)]n-R', has a molecular weight of 100-1,000, and has a pKa for at least one of disubstituted amino group (CH3) in the formula of 8.0 or more. In the formula, each R independently represents a monovalent hydrocarbon group, n is an integer of 1 or greater, and R' represents an n-valent organic group.SELECTED DRAWING: Figure 1 【課題】室温程度の低温において短時間に硬化可能で、樹脂揮発による周囲への汚染が起こりにくい、電子部品製造用一液型接着剤として好適な樹脂組成物の提供。【解決手段】本発明の樹脂組成物は、少なくとも一種の2-メチレン-1,3-ジカルボニル化合物及び少なくとも一種の第三級アミン化合物を含む。前記2-メチレン-1,3-ジカルボニル化合物は各々、下記式TIFF2023082711000017.tif24164で表される構造単位を少なくとも1つ有し、かつ分子量が180~10000である。前記第三級アミン化合物は各々、式[NR(CH3)]n-R'(式中、各々のRは独立に1価の炭化水素基を表し、nは1以上の整数であり、R'はn価の有機基を表す)で表され、分子量が100~1000であり、かつ式中の二置換アミノ基NR(CH3)-の少なくとも1つについて、pKaが8.0以上である。【選択図】図1
Bibliography:Application Number: JP20230025901