POLISHING PAD AND METHOD FOR PREPARING SEMICONDUCTOR DEVICE USING THE SAME

To provide a polishing pad, a process for preparing the same, and a process for preparing a semiconductor device using the same.SOLUTION: In the polishing pad, the surface zeta potential and its ratio of a polishing surface are controlled to specific ranges according to the type of polishing slurry,...

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Bibliographic Details
Main Authors KIM KYUNG HWAN, HEO HYE YOUNG, AHN JAEIN, YUN JONG WOOK
Format Patent
LanguageEnglish
Japanese
Published 06.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:To provide a polishing pad, a process for preparing the same, and a process for preparing a semiconductor device using the same.SOLUTION: In the polishing pad, the surface zeta potential and its ratio of a polishing surface are controlled to specific ranges according to the type of polishing slurry, so that it is possible to improve characteristics of scratches and surface defects appearing on a surface of a semiconductor substrate and to further enhance the polishing rate.SELECTED DRAWING: Figure 2 【課題】本発明は、研磨パッド、その製造方法およびこれを用いた半導体素子の製造方法を提供する。【解決手段】研磨パッドは、研磨スラリーの種類による研磨面の表面ゼータ電位およびその比を特定範囲に制御することにより、半導体基板の表面上に現れるスクラッチおよび表面欠陥の特性を向上させることができ、研磨率をさらに向上させ得る。【選択図】図２
Bibliography:Application Number: JP20230032028