HEAT CURABLE RESIN COMPOSITION AND CURED FILM

• Main Authors: MATSUDA TOMOYA, MORIWAKI YUYA, ASADA KOSUKE, TAKENAKA NAOMI, NONMI KATSU, NAKAGAWA HIROKI, YOSHIDA SHIGETOSHI
• Format: Patent
• Language: English; Japanese
• Published: 06.06.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a heat curable resin composition designed to facilitate high solidification.SOLUTION: A heat curable resin composition causes at least two kinds of reactions of interesterification reaction and other chemical reactions that proceed thermally. The heat curable resin composition needs a polyol compound (A) and a transesterification catalyst (B), and contains a composition (X) that causes a reaction other than interesterification reaction. The composition (X) has an alkyl ester group.SELECTED DRAWING: None 【課題】ハイソリッド化が容易であるような熱硬化性樹脂組成物を提供する。【解決手段】エステル交換反応及びその他の熱的に進行する化学反応の少なくとも２種類の反応を生じる熱硬化性樹脂組成物であって、ポリオール化合物（Ａ）及びエステル交換触媒（Ｂ）を必須とし、エステル交換反応以外の反応を生じさせる組成物（Ｘ）を含有するものであり、組成物（Ｘ）は、アルキルエステル基を有するものである熱硬化性樹脂組成物。【選択図】 なし