SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

• Main Authors: YAMAZAKI TAKESHI, YAHIRO SHUNICHI, KAJIWARA HIRONOBU, HIRAKAWA HIDEKI
• Format: Patent
• Language: English; Japanese
• Published: 01.06.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

To provide a technology for controlling the cost of a substrate processing device.SOLUTION: The substrate processing device includes a first processing group, a second processing group, and a delivery mechanism. The first processing group processes a substrate. The second processing group processes the substrate processed by the first processing group. The delivery mechanism transfers substrates between the first and second processing groups. At least some of the first and second processing groups are provided in a stacked manner in the vertical direction. At least some of the processing parts in the first and second processing groups process a substrate that is transported horizontally and whose direction of travel is changed by 90 degrees in the processing part.SELECTED DRAWING: Figure 1 【課題】基板処理装置のコストを抑制する技術を提供する。【解決手段】実施形態に係る基板処理装置は、第１処理群と、第２処理群と、受渡機構とを備える。第１処理群は、基板に処理を行う。第２処理群は、第１処理群によって処理が行われた基板に処理を行う。受渡機構は、第１処理群と第２処理群との間で基板の受け渡しを行う。第１処理群、および第２処理群の少なくとも一部は、上下方向に積層して設けられる。第１処理群、および第２処理群における少なくとも一部の処理部は、水平方向に搬送され、かつ処理部内で進行方向が９０度変更される基板に処理を行う。【選択図】図１