EPOXY RESIN

• Main Authors: AOYAMA KAZUMASA, AKIMOTO GENSUKE, YAMOTO KAZUHISA
• Format: Patent
• Language: English; Japanese
• Published: 30.05.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

To provide an epoxy resin that achieves high compatibility between low viscosity when melted and low moisture absorptivity, low thermal elasticity, and high adhesion of a cured product thereof.SOLUTION: The present invention relates to an epoxy resin that is a glycidyl-etherified, polyhydric hydroxy resin comprising, as a reaction material (1), an aromatic compound (A) comprising a phenolic hydroxy group and two or more hydrocarbon groups in an aromatic ring and an aromatic divinyl compound (B1).SELECTED DRAWING: None 【課題】溶融時の低粘度性、並びに硬化物の低吸湿率、熱時低弾性、及び高密着性を高次に両立することができるエポキシ樹脂を提供することにある。【解決手段】本発明は、フェノール性水酸基及び２以上の炭化水素基を芳香環に有する芳香族化合物（Ａ）と芳香族ジビニル化合物（Ｂ１）とを反応原料（１）とする多価ヒドロキシ樹脂のグリシジルエーテル化物であるエポキシ樹脂に関する。【選択図】なし