SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE

• Main Author: NAKANISHI MASAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 30.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a substrate treatment method which enables efficient processing without having to adjust CMP processing conditions according to a shape of a bevel part of each substrate, in applying CMP processing to a plane part of a substrate for a plurality of substrates.SOLUTION: In a substrate treatment method, a bevel part B of a plurality of substrates W are polished with a polishing tool and CMP processing is applied to a plane part P of the plurality of substrates W in which the bevel part B has been polished, so that an inclined angle α of an inclined surface S of the bevel part B of the plurality of substrates W are the same.SELECTED DRAWING: Figure 5 【課題】複数の基板について基板の平面部のＣＭＰ処理を行う際に、各基板のベベル部の形状に応じてＣＭＰ処理条件を調整することなく、効率良く処理することができる基板処理方法提供する。【解決手段】基板処理方法は、複数の基板Ｗのベベル部Ｂの傾斜面Ｓの傾斜角度αが同じとなるように、複数の基板Ｗのベベル部Ｂを研磨具で研磨し、ベベル部Ｂが研磨された複数の基板Ｗの平面部ＰをＣＭＰ処理する。【選択図】図５