CARRIER SUBSTRATE FOR FORMING RESIN FILM, METHOD FOR PRODUCING RESIN FILM USING THE SAME, AND METHOD FOR MANUFACTURING ELECTRIC DEVICE USING THE RESIN FILM

• Main Authors: KIM DUCK KYEOM, CHOI JEONG MIN, KIM BEOM CHEOL
• Format: Patent
• Language: English; Japanese
• Published: 29.05.2023
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TRANSPORTING

To provide a carrier substrate for forming a resin film having improved mechanical reliability, a method for producing a resin film using the same, and a method for manufacturing an electric device using the resin film.SOLUTION: A carrier substrate comprises: a support substrate including a first surface on which a resin film is formed and a second surface opposing the first surface; and a stress compensation layer formed of an inorganic substance on the second surface of the support substrate. By using the carrier substrate, there can be formed a resin film with suppressed curling. The resin film can be offered as a flexible substrate and a base film of an electric device.SELECTED DRAWING: Figure 1 【課題】向上した機械的信頼性を有する樹脂フィルム形成用キャリア基板、それを用いた樹脂フィルムの製造方法およびそれを用いた電気デバイスの製造方法を提供すること。【解決手段】キャリア基板は、樹脂フィルムが形成される第１面、および前記第１面に対向する第２面を含む支持基板と、支持基板の第２面上に無機物質で形成された応力補償層とを含む。キャリア基板を用いることにより、カールが抑制された樹脂フィルムを形成することができる。樹脂フィルムは、電気デバイスのフレキシブル基板、ベースフィルムとして提供することができる。【選択図】図１