SEMICONDUCTOR MODULE

• Main Authors: KATO TAKAHIDE, FUKUTANI KEITA, OMAE SHOICHIRO, KUSAMA HIROTOSHI, INOUE NORIHIRO, FURUKAWA TAIJI, NAGAI SHUNA, ARAI SHUNSUKE, MIWA RYOTA
• Format: Patent
• Language: English; Japanese
• Published: 29.05.2023
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

To provide a semiconductor module in which a power route and a signal route can be surely electrically insulated.SOLUTION: A semiconductor module 10 houses a semiconductor element 30 and a heat dissipation member 40 by a resin member 9. At least a part of the heat discharge member 40 is exposed to an external part from the resin member 9. A signal pad 35 of the semiconductor element 30 and a signal terminal 61 are connected by a flexible substrate as a wiring member 80. The wiring member 80 is housed in a resin member 20, and is a member softer than the signal terminal 61. The wiring member 80 includes: electric insulation resin layers 81 and 83; and a metal layer 82 supported by resin layers 81 and 83.SELECTED DRAWING: Figure 3 【課題】電力経路と信号経路との電気的な絶縁が確実な半導体モジュールを提供する。【解決手段】半導体モジュール１０は、樹脂部材９によって、半導体素子３０と、放熱部材４０とを収容している。放熱部材４０の少なくとも一部は、樹脂部材９から外部に露出している。半導体素子３０の信号パッド３５と信号端子６１とは、配線部材８０としてのフレキシブル基板によって接続されている。配線部材８０は、樹脂部材２０に収容されており、信号端子６１より柔軟な部材である。配線部材８０は、電気絶縁性の樹脂層８１、８３、および、樹脂層８１、８３に支持された金属層８２を含む。【選択図】図３