ETCHING METHOD FOR CLAD MATERIAL

• Main Authors: KANDA MIHO, ARIHARA HIROYUKI, FUJITA NAOKI
• Format: Patent
• Language: English; Japanese
• Published: 25.05.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE

To provide an etching method capable of easily etching a clad material.SOLUTION: The etching method for a clad material includes: a step of forming resist layers 4 on both surfaces of a clad material 1 comprising a copper metal layer 2 and a stainless metal layer 3; a primary etching step of respectively etching the copper metal layer 2 and the stainless metal layer 3 using a first etchant with the resist layers 4 as masks; and a secondary etching step of selectively etching the copper metal layer 2 using a second etchant having a lower concentration than the first etchant with the resist layers 4 as masks.SELECTED DRAWING: Figure 1 【課題】クラッド材を簡便にエッチング可能なエッチング方法を提供する。【解決手段】銅の金属層２及びステンレスの金属層３から成るクラッド材１の両面にレジスト層４を形成する工程と、レジスト層４をマスクとして、第１のエッチング液を用いて銅の金属層２及びステンレスの金属層３をそれぞれエッチングする１次エッチング工程と、レジスト層４をマスクとして、第１のエッチング液より低濃度の第２のエッチング液を用いて銅の金属層２を選択的にエッチングする２次エッチング工程と、を含むクラッド材のエッチング方法。【選択図】図１