ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING

• Main Authors: TANIGUCHI TAKAHISA, FURIHATA WATARU, MURAKAMI YUKA, UCHIDA HIROAKI
• Format: Patent
• Language: English; Japanese
• Published: 18.05.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide an adhesive tape for semiconductor processing with excellent peelability to ring frames after energy beam irradiation.SOLUTION: An adhesive tape 10 for semiconductor processing has a base material 1 and an energy ray curable adhesive layer 2 disposed on one side of the base material 1, the maximum shear stress is between 1 MPa and 25 MPa and the maximum elongation is between 3 mm and 30 mm when the adhesive tape for semiconductor processing is attached to a SUS plate, irradiated with energy ray and pulled parallel to the adhesive surface of the adhesive tape for semiconductor processing and the SUS plate.SELECTED DRAWING: Figure 1 【課題】エネルギー線照射後のリングフレームに対する剥離性に優れる半導体加工用粘着テープを提供する。【解決手段】基材１と、基材１の一方の面に配置されたエネルギー線硬化性の粘着層２と、を有する半導体加工用粘着テープ１０であって、半導体加工用粘着テープをＳＵＳ板に貼り付け、エネルギー線を照射し、半導体加工用粘着テープ及びＳＵＳ板の粘着面に平行に引っ張ったときの、最大せん断応力が１ＭＰａ以上２５ＭＰａ以下であり、最大伸びが３ｍｍ以上３０ｍｍ以下である。【選択図】図１