METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PROCESSING SYSTEM

To provide a technique for shortening processing time required for opening formation.SOLUTION: A method for manufacturing a printed wiring board includes: preparing a middle substrate having an insulation layer, a first conductor layer including a plurality of conductor circuits on the insulation la...

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Bibliographic Details
Main Authors OTSUKI TAKUYA, YAMAUCHI TSUTOMU, SANO MASANORI, TAKAGI TAKESHI, KAWAGUCHI KATSUO
Format Patent
LanguageEnglish
Japanese
Published 18.05.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:To provide a technique for shortening processing time required for opening formation.SOLUTION: A method for manufacturing a printed wiring board includes: preparing a middle substrate having an insulation layer, a first conductor layer including a plurality of conductor circuits on the insulation layer, and a first resin insulation layer formed on the insulation layer and the first conductor layer; preparing a laser beam machine for forming an opening for a via conductor passing through the first resin insulation layer and reaching the first conductor layer; providing a position where the opening is formed to the laser beam machine; classifying the conductor circuits under the position; providing the number of shots for forming the opening on the basis of the classification to the laser beam machine; and forming the opening on the basis of the position and the number of shots. The classification includes classifying the conductor circuits into a first classification and a second classification. The number of shots for forming the opening reaching the conductor circuit belonging to the first classification is smaller than the number of shots for forming the opening to the conductor circuit belonging to the second classification.SELECTED DRAWING: Figure 1 【課題】開口形成に要する加工時間を短縮するための技術の提供。【解決手段】プリント配線板の製造方法は、絶縁層と絶縁層上の複数の導体回路を含む第１導体層と絶縁層と第１導体層上に形成されている第１樹脂絶縁層とを有する途中基板を準備することと、第１樹脂絶縁層を貫通し第１導体層に至るビア導体用の開口を形成するためのレーザ加工機を準備することと、開口を形成する位置をレーザ加工機に提供することと、位置下の導体回路を分類することと、分類に基づいて開口を形成するためのショット数をレーザ加工機に提供することと、位置とショット数に基づいて開口を形成すること、とを有する。分類することは導体回路を第１分類と第２分類に層別することを含む。第１分類に属する導体回路に至る開口を形成するためのショット数は第２分類に属する導体回路に至る開口を形成するためのショット数より小さい。【選択図】図１
Bibliography:Application Number: JP20210180826