ELECTROMAGNETIC WAVE TRANSMISSION COVER AND METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE TRANSMISSION COVER

• Main Author: MATSUI TATSUYA
• Format: Patent
• Language: English; Japanese
• Published: 16.05.2023
• Subjects: ANALOGOUS ARRANGEMENTS USING OTHER WAVES; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES; MEASURING; PERFORMING OPERATIONS; PHYSICS; RADIO DIRECTION-FINDING; RADIO NAVIGATION; TESTING; TRANSPORTING; VEHICLES IN GENERAL; VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR

To provide an electromagnetic wave transmission cover that can be easily manufactured and a method for manufacturing the electromagnetic wave transmission cover.SOLUTION: A cover body part 15 of a millimeter wave transmission cover 13 which is located in front of a millimeter wave radar device 12 mounted on a vehicle 11 comprises a cover base material 16, a heater film 17 which adjoins the rear of the cover base material 16, and a terminal part 22 which adjoins the rear of the cover base material 16 and is electrically connected to the heater film 17. The heater film 17 includes a film base material 19, and a heat generating part 20 which is provided on the front of the film base material 19 and generates heat upon energization. A portion of the heat generating part 20 protrudes from the film base material 19. The terminal part 22 is joined to the portion of the heat generating part 20 protruding from the film base material 19. The junction 27 of the terminal part 22 and the heat generating part 20 is covered with the cover base material 16.SELECTED DRAWING: Figure 1 【課題】容易に製造することができる電磁波透過カバー及び電磁波透過カバーの製造方法を提供する。【解決手段】車両１１に搭載されるミリ波レーダ装置１２の前方に配置されるミリ波透過カバー１３のカバー本体部１５は、カバー基材１６と、カバー基材１６の後部に隣接するヒータフィルム１７と、カバー基材１６の後部に隣接し且つヒータフィルム１７と電気的に接合される端子部２２とを備える。ヒータフィルム１７は、フィルム基材１９と、フィルム基材１９の前面に設けられ且つ通電により発熱する発熱部２０とを備える。発熱部２０の一部は、フィルム基材１９から突出している。端子部２２は、発熱部２０におけるフィルム基材１９から突出した部分に接合されている。端子部２２と発熱部２０との接合部分２７は、カバー基材１６に覆われている。【選択図】図１