ADHESIVE TAPE FOR LASER DICING

• Main Authors: SUZUKI KYOICHI, SHIRAISHI YURI
• Format: Patent
• Language: English; Japanese
• Published: 10.05.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide an adhesive tape for laser dicing that prevents chips from flying off or defects from being caused by a water flow during dicing in the laser dicing where laser is guided by a water jet and does not leave adhesive residue on chips (adhesive layer rolls onto chips) when picking up individual chips.SOLUTION: The adhesive tape is formed by sequentially laminating a substrate, an adhesive layer on one surface of the substrate, and a separator film. The substrate is a mesh substrate having opening portions formed by fibers. The adhesive layer is composed of an adhesive composition including a compound containing hydroxyl groups. The adhesive layer is not a continuous film. The adhesive tape has an opening part located at least in a location coincident with a portion of an opening part on the front surface of the mesh substrate.SELECTED DRAWING: Figure 1 【課題】レーザーがウォータージェットでガイドされるレーザーダイシングにおいて、ダイシング時の水流によるチップ飛びや、チップの欠陥が生じることを防止し、さらに個片化したチップのピックアップ時にチップへ糊残り（粘着剤層の転着）しないレーザーダイシング用粘着テープを提供すること。【解決手段】基材と、前記基材の一方の面の上に粘着剤層とセパレータフィルムとを順次積層した粘着テープであり、前記基材は繊維で形成された開口部を有するメッシュ基材とし、前記粘着剤層は水酸基含有化合物を含む粘着剤組成物からなり、かつ、前記粘着剤層は連続膜ではなく、少なくとも前記メッシュ基材の表面の開口部と一致した位置に開口部を有する粘着テープとする。【選択図】図１