PROCESSING OBJECT SUPPORT DEVICE AND LASER PROCESSING DEVICE

• Main Author: YAEGASHI TAKAAKI
• Format: Patent
• Language: English; Japanese
• Published: 02.05.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a processing object support device capable of reducing deterioration of location accuracy of a processing spot, even when supporting a linear processing object on one side of the processing spot.SOLUTION: A support member has a groove for supporting a linear processing object. A constrain...