PROCESSING OBJECT SUPPORT DEVICE AND LASER PROCESSING DEVICE

• Main Author: YAEGASHI TAKAAKI
• Format: Patent
• Language: English; Japanese
• Published: 02.05.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a processing object support device capable of reducing deterioration of location accuracy of a processing spot, even when supporting a linear processing object on one side of the processing spot.SOLUTION: A support member has a groove for supporting a linear processing object. A constraint mechanism constrains the position of the processing object in a direction orthogonal to the axial direction, on some spot in the axial direction of the processing object. The constraint mechanism has a contact with the processing object on three or more spots relative to a circumferential direction of the processing object, and at least one first contact spot is deviated in the axial direction of the processing object to the other second contact spots.SELECTED DRAWING: Figure 1 【課題】線状の加工対象物を加工箇所の片側で支持する場合でも、加工箇所の位置精度の低下を少なくすることが可能な加工対象物支持装置を提供する。【解決手段】支持部材が、線状の加工対象物を支持する溝を有する。拘束機構が、加工対象物の軸方向のある箇所において、軸方向に対して直交する方向における加工対象物の位置を拘束する。拘束機構は、加工対象物の周方向に関して３箇所以上の複数箇所で加工対象物に接触し、少なくとも１つの第１接触箇所は、他の複数の第２接触箇所に対して加工対象物の軸方向にずれている。【選択図】図１