METHOD FOR MANUFACTURING RESIN-ENCAPSULATED ELECTRONIC SUBSTRATE

To prevent short-circuiting between two or more terminals of an electronic component on a substrate during manufacture of a resin-sealed electronic substrate.SOLUTION: A manufacturing method of a resin-sealed electronic substrate includes a covering layer forming step of forming a covering layer 24...

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Bibliographic Details
Main Authors ITO ATSUHIKO, NONOYAMA HAJIME
Format Patent
LanguageEnglish
Japanese
Published 02.05.2023
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:To prevent short-circuiting between two or more terminals of an electronic component on a substrate during manufacture of a resin-sealed electronic substrate.SOLUTION: A manufacturing method of a resin-sealed electronic substrate includes a covering layer forming step of forming a covering layer 24 by holding a substrate 22 mounted with an electronic component 20 in a molding die 60, and filling and solidifying a space formed by a main surface 22A and the molding die with a molten insulating resin from a gate 62B provided in the molding die, and the substrate 22 has a through-hole 40A having a shape that crosses a region R formed by connecting a position corresponding to the gate 62B in the state held in the molding die 60 and the outer edges of lands 34a and 34k with a straight line, and the molding die 60 has projections 68 that fit into through holes 40A, and holds the substrate 22 with projections 68 protruding from the main surface 22A of the substrate 22.SELECTED DRAWING: Figure 4 【課題】樹脂封止型電子基板の製造時において、基板上の電子部品が有する２以上の端子間のショートを防止する。【解決手段】電子部品２０が実装された基板２２を成形型６０内に保持させ、主面２２Ａと成形型とによって形成される空間に、溶融した絶縁性樹脂を成形型が備えるゲート６２Ｂから充填して固化させることによって、被覆層２４を成形する被覆層成形工程を含み、基板２２は、成形型６０内に保持された状態におけるゲート６２Ｂに対応する位置とランド３４ａ，３４ｋの外縁とを直線で結んで形成される領域Ｒを横断する形状の貫通孔４０Ａを有するものとし、成形型６０が、貫通孔４０Ａに嵌入する凸部６８を有し、凸部６８が基板２２の主面２２Ａから突出した状態で基板２２を保持するように構成する。【選択図】図４
Bibliography:Application Number: JP20210171392