ATTACHMENT STRUCTURE OF CEILING EMBEDDED DEVICE

To provide an attachment structure of a ceiling embedded device which can meet predetermined fire-resistance standards without lowering a ceiling significantly and facilitate construction of a heat insulation cover.SOLUTION: An attachment structure 2 of a ceiling embedded device includes: a ceiling...

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Bibliographic Details
Main Authors URUSHIBARA SHIN, TASATO KAORI
Format Patent
LanguageEnglish
Japanese
Published 28.04.2023
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Summary:To provide an attachment structure of a ceiling embedded device which can meet predetermined fire-resistance standards without lowering a ceiling significantly and facilitate construction of a heat insulation cover.SOLUTION: An attachment structure 2 of a ceiling embedded device includes: a ceiling 22 formed by a ceiling board 21 which meets predetermined fire-resistance standards; a ceiling embedded device 1 which is embedded on a ceiling space with a lower surface exposed at an opening provided at the ceiling 22; and a heat insulation box 5 which has a box shape in which the lower side is open and encloses the ceiling embedded device 1 with an upper plate 50 and a side plate 51. The heat insulation box 5 meets the same predetermined fire-resistance standards as the ceiling board 21.SELECTED DRAWING: Figure 1 【課題】 天井を大きく下げることなく所定の耐火基準を充たすことができ、断熱被覆の施工を容易にすることができる天井埋め込み装置の取付構造を提供する。【解決手段】天井埋め込み装置の取付構造2は、所定の耐火基準を充たす天井板21により形成される天井22と、前記天井22に設けられた開口に下面を露出させつつ天井裏に埋め込まれる天井埋め込み装置1と、下方が解放された箱形状であり、上板50と側板51とで前記天井埋め込み装置1を囲う断熱ボックス5と、を備え、前記断熱ボックス5は前記天井板21と同じ前記所定の耐火基準を充たす。【選択図】図1
Bibliography:Application Number: JP20210170334