METAL PASTE

• Main Authors: SATO HIRONORI, TAKAHASHI SHUNTARO, FUJITA YUKI, OSHIMA YUSUKE, OTAKE SHIGEYUKI, IWAI TERUHISA
• Format: Patent
• Language: English; Japanese
• Published: 27.04.2023
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CASTING; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; POWDER METALLURGY; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING METALLIC POWDER

To provide a metal paste containing metal particles composed of silver particles as a solid content which enables formation of a metal wiring line which exhibits good adhesion, while having good printing and drawing properties and good continuous printability.SOLUTION: The present invention relates to a metal paste for forming metal wiring lines, the metal paste being obtained by kneading a solid content that is composed of silver particles into a solvent. The solid content of the metal paste is composed of silver particles which have a specific particle size distribution and a specific average particle diameter, while using an amine compound as a protective agent. The solvent is a mixed solvent which is obtained by mixing two organic solvents, namely a solvent A and a solvent B. The solvent A is composed of dihydroterpineol or terpineol; and the solvent B is composed of at least one organic solvent that has a boiling point of 240°C or more. This mixed solvent has a distance Ra of Hansen solubility parameter of 3.0 MPa1/2 or less with respect to dihydroterpineol. In addition, the metal paste contains a high-molecular-weight ethyl cellulose as a first additive, while containing a polyvinyl acetal resin as a second additive.SELECTED DRAWING: Figure 3 【課題】銀粒子からなる金属粒子を固形分として含む金属ペーストに関して、印刷描画性及び連続印刷性が良好であると共に密着性良好な配線を形成可能なものを提供する。【解決手段】本発明は、銀粒子からなる固形分を溶剤に混練してなる金属配線形成用の金属ペーストに関する。金属ペーストの固形分は、所定の粒径分布及び平均粒径を有し、アミン化合物を保護剤とする銀粒子からなる。溶剤は、溶剤Ａ及び溶剤Ｂの２種の有機溶剤を混合した混合溶剤である。溶剤Ａはジヒドロターピネオール又はターピネオールであり、溶剤Ｂは、沸点２４０℃以上の少なくとも１種の有機溶剤である。そして、この混合溶剤は、ジヒドロターピネオールに対するハンセン溶解度パラメータの距離Ｒａが３．０ＭＰａ１／２以下である。更に、金属ペーストには、第１の添加剤として高分子量エチルセルロースと、第２の添加剤としてポリビニルアセタール樹脂が含まれる。【選択図】図３