EPOXY RESIN COMPOSITION AND PREPREG

• Main Authors: IKEDA HIROKI, TAKEDA ICHIRO, MACHIDA GIMPEI
• Format: Patent
• Language: English; Japanese
• Published: 25.04.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a resin composition that has excellent light resistance and handleability at a room temperature, causes less resin flow during curing and molding, and also excels in the bendability of a cured product, and a prepreg including the resin composition impregnated into a fiber substrate.SOLUTION: In order to solve the foregoing problem, the present invention provides a resin composition having a following structure: an epoxy resin composition including components [A], [B], [C], and [D]. [A] A non-aromatic epoxy resin. [B] A non-aromatic epoxy resin including at least two epoxy groups and at least two hydroxy groups in the structure, and also having a sulfide bond. [C] A curing agent. [D] A non-aromatic thermoplastic resin.SELECTED DRAWING: None 【課題】本発明では、耐光性および室温における取り扱い性に優れ、硬化成形時の樹脂フローが少なく、かつ硬化物の曲げ特性にも優れた樹脂組成物、およびかかる樹脂組成物が繊維基材に含浸されて成るプリプレグを提供することを課題とする。【解決手段】上記課題を解決するために、本発明は、次の構成を有する樹脂組成物を提供する。構成要素［Ａ］、［Ｂ］、［Ｃ］、［Ｄ］を含むエポキシ樹脂組成物。［Ａ］非芳香族エポキシ樹脂［Ｂ］構造中に少なくとも２個のエポキシ基、少なくとも２個の水酸基を含み、スルフィド結合を有する非芳香族エポキシ樹脂［Ｃ］硬化剤［Ｄ］非芳香族熱可塑性樹脂【選択図】なし