FLOW RESISTANCE GENERATION UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

• Main Authors: KIM YUN SU, KORIAKIN ANTON, SUNG JIN YEONG, SHIN JAE WON, WON JOON HO, KANG HYUNG SEOK, CHOI HAE WON, LEE JAE SEONG, KIM MIN WOO, HEO PIL KYUN
• Format: Patent
• Language: English; Japanese
• Published: 20.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a flow resistance generation unit and a substrate processing apparatus including the same in a piping to stabilize an internal airflow.SOLUTION: A substrate processing apparatus 100 includes a housing 110, a support unit 130 provided inside the housing and supporting a substrate W on both sides, a heating member 140 provided on a side wall of the housing and generating heat for processing the substrate, a fluid supply unit 150 including an upper fluid supply portion 151 for supplying fluid for processing the substrate to the inside of the housing and supplying the fluid to an upper part of the substrate, a lower fluid supply portion 152 for supplying the fluid to a lower part of the substrate, and a supply line 153 connected to at least one fluid supply portion of the upper fluid supply portion and the lower fluid supply portion, and a flow resistance generation unit 180 provided in the supply line and generating flow resistance against the fluid passing through the supply line, and the flow resistance generation unit is provided between the curved pipe included in the supply line and the fluid supply portion.SELECTED DRAWING: Figure 1 【課題】内部気流を安定化させるために配管内に設けられる流動抵抗発生ユニットおよびそれを含む基板処理装置を提供する。【解決手段】基板処理装置１００は、ハウジング１１０と、ハウジングの内部に設けられ、両側で基板Ｗを支持する支持ユニット１３０と、ハウジングの側壁に設けられ、基板を処理するための熱を発生させる加熱部材１４０と、ハウジングの内部に基板を処理するための流体を供給し、流体を基板の上部に供給する上部流体供給部１５１、流体を基板の下部に供給する下部流体供給部１５２並びに上部流体供給部および下部流体供給部の少なくとも一つの流体供給部と連結される供給配管１５３を含む流体供給ユニット１５０と、供給配管に設けられ、供給配管を通過する流体に対して流動抵抗を発生させる流動抵抗発生ユニット１８０と、を含む。流動抵抗発生ユニットは、供給配管に含まれる曲管と流体供給部の間に設けられる。【選択図】図１