WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

• Main Authors: ADACHI TAKEMA, IGAWA YUJI
• Format: Patent
• Language: English; Japanese
• Published: 20.04.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a printed wiring board in which a thickness of at conductor layer, which has a form embedded within the insulation layer, is precisely controlled.SOLUTION: A method for manufacturing a wiring board of an embodiment includes: forming a first resin insulating layer 111 and a second resin insulating layer 112 in contact with an upper surface of the first resin insulating layer 111; forming recesses op1 and op2 that penetrate the second resin insulating layer 112 and expose the first resin insulating layer 111 at a bottom by radiating laser light; filling the recesses op1 and op2 with a conductor to form a first conductor layer 121 having a form embedded in the second resin insulating layer 112. The first resin insulating layer 111 and the second resin insulating layer 112 have different workability to the laser beam respectively.SELECTED DRAWING: Figure 2 【課題】絶縁層内に埋め込まれる形態を有する導体層の厚さが精密に制御されるプリント配線板の提供。【解決手段】実施形態の配線基板の製造方法は、第１樹脂絶縁層１１１と第１樹脂絶縁層１１１の上面に接する第２樹脂絶縁層１１２を形成することと、第２樹脂絶縁層１１２を貫通し底部に第１樹脂絶縁層１１１を露出する凹部ｏｐ１、ｏｐ２をレーザー光の照射によって形成することと、凹部ｏｐ１、ｏｐ２を導体で充填し、第２樹脂絶縁層１１２に埋め込まれる形態を有する第１導体層１２１を形成することと、を含む。第１樹脂絶縁層１１１と第２樹脂絶縁層１１２とはレーザー光に対する被加工性が異なる。【選択図】図２