WAFER PROTECTIVE TAPE

• Main Authors: CHO YEONG SEOK, CHOI JAE WON, YOON KEUN YOUNG, CHO HYEONG JUN, KIM HYO RIM
• Format: Patent
• Language: English; Japanese
• Published: 19.04.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a wafer protective tape that can replace the role of an epoxy sealant for protecting a semiconductor chip, and that can be thinned and reduced in cost.SOLUTION: A wafer protective tape 100 includes a release layer 120, a soft adhesive layer 140 disposed on the release layer, and a hard layer 160 disposed on the soft adhesive layer and containing a polymer resin and a colorant, and satisfies the following formula 1. 0%≤|A+B|≤1.0%. Here, A indicates the change rate (%) in the length direction after heating the wafer protective tape at 150°C for one hour, and B indicates the change rate (%) in the width direction after heating the wafer protective tape at 150°C for one hour.SELECTED DRAWING: Figure 3 【課題】半導体チップを保護するエポキシ封止剤としての役割を代替することができ、かつ、薄型化及びコスト削減を図ることのできるウエハ保護テープを提供する。【解決手段】ウエハ保護テープ１００は、離型層１２０、離型層上に配置された軟質接着層１４０及び軟質接着層上に配置されて、高分子樹脂、かつ、着色剤を含む硬質層１６０を含み、下記の一般式１を満たす。［一般式１］０％≦｜Ａ＋Ｂ｜≦１．０％ここで、Ａは、前記ウエハ保護テープを１５０℃で１時間加熱した後の長さ方向における変化率（％）を示し、Ｂは、前記ウエハ保護テープを１５０℃で１時間加熱した後の幅方向における変化率（％）を示す。【選択図】図３