JUNCTION SYSTEM AND JUNCTION METHOD

• Main Authors: MATSUBARA YOSHIHISA, NODA KAZUTAKA, MIMURA TAKEYUKI
• Format: Patent
• Language: English; Japanese
• Published: 19.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a technique capable of improving the bonding quality of a polymerized substrate.SOLUTION: A junction system includes a surface modification unit, a joining unit, and a control unit. The surface modification unit performs surface modification treatment to modify an insulating film out of t...