JUNCTION SYSTEM AND JUNCTION METHOD

• Main Authors: MATSUBARA YOSHIHISA, NODA KAZUTAKA, MIMURA TAKEYUKI
• Format: Patent
• Language: English; Japanese
• Published: 19.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a technique capable of improving the bonding quality of a polymerized substrate.SOLUTION: A junction system includes a surface modification unit, a joining unit, and a control unit. The surface modification unit performs surface modification treatment to modify an insulating film out of the insulating film and a metal wiring located on the surface of the substrate by plasma of processing gas. The joining unit performs a series of joining processing to join two substrates whose insulating film has been modified by surface modification treatment by intermolecular force. The control unit acquires a piece of information about the thickness of the metal oxide film on the surface of the substrate before the surface modification treatment and determines the treatment conditions for the surface modification treatment based on the acquired information.SELECTED DRAWING: Figure 13 【課題】重合基板の接合品質を向上させることができる技術を提供する。【解決手段】本開示による接合システムは、表面改質装置と、接合装置と、制御部とを備える。表面改質装置は、基板の表面に位置する絶縁膜および金属配線のうち絶縁膜を処理ガスのプラズマによって改質する表面改質処理を行う。接合装置は、表面改質処理によって絶縁膜が改質された２つの基板を分子間力により接合する接合処理を行う。制御部は、表面改質処理前における基板の表面の金属酸化膜の膜厚に関する情報を取得し、取得した情報に基づいて表面改質処理の処理条件を決定する。【選択図】図１３