FLUX AND SOLDER PASTE

To provide flux that can suppress increase in solder paste viscosity over time and can improve solder cohesiveness during reflow, and a solder paste.SOLUTION: Flux contains a chelate agent and an organic sulfonic acid. The chelate agent contains a compound with five-membered ring structure comprisin...

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Bibliographic Details
Main Authors TAKAGI TOMOKO, INOUE KENTA
Format Patent
LanguageEnglish
Japanese
Published 18.04.2023
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:To provide flux that can suppress increase in solder paste viscosity over time and can improve solder cohesiveness during reflow, and a solder paste.SOLUTION: Flux contains a chelate agent and an organic sulfonic acid. The chelate agent contains a compound with five-membered ring structure comprising nitrogen atom, sulfur atom and carbon atom.SELECTED DRAWING: None 【課題】ソルダペーストの経時的な粘度上昇を抑制できるとともに、リフロー時にはんだの凝集性が高められるフラックス及びソルダペーストを提供する。【解決手段】キレート剤と、有機スルホン酸とを含有するフラックスを採用する。前記キレート剤は、窒素原子、硫黄原子及び炭素原子からなる五員環構造を有する化合物を含む。【選択図】なし
Bibliography:Application Number: JP20210164791