WIRE SAW AND PROCESSING METHOD BY WIRE SAW

• Main Author: MASUDA MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 11.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

To provide a wire saw which can improve work-piece cutting accuracy and cutting speed, and has high productivity.SOLUTION: A wire saw has a wire row 2A which is formed by winding a wire 2 between a plurality of groove rollers 40, and cuts a work-piece W by pressing the work-piece against the wire row 2A while traveling the wire 2. The wire saw comprises: a holding table 10 which holds the work-piece W; a lifting mechanism 20 for the holding table 10; a working liquid tank 50 in which a working liquid 3 is accumulated; and partition walls 30L, 30R which widen in a direction crossing a travel direction of the wire 2, and are erected on both sides in the travel direction of the wire 2 via the work-piece W. The working liquid tank 50 can accumulate the working liquid 3 to a height at which a part of a formation surface of the wire row 2A is immersed, and the partition walls 30L, 30R reach from above the work-piece W to below a cutting start end of the work-piece W.SELECTED DRAWING: Figure 1 【課題】被加工物の切断精度及び切断速度の向上が可能な生産性が高いワイヤソーを提供する。【解決手段】複数の溝ローラ４０間にワイヤ２を巻き掛けることにより形成されたワイヤ列２Ａを有し、ワイヤ２を走行させながら、被加工物Ｗをワイヤ列２Ａに対して押し付けることにより切断するワイヤソーであって、被加工物Ｗを保持する保持テーブル１０と、保持テーブル１０の昇降機構２０と、加工液３が貯留された加工液槽５０と、ワイヤ２の走行方向に対して交差する方向に拡がると共に、被加工物Ｗを介してワイヤ２の走行方向両側に立設された仕切壁３０Ｌ，３０Ｒとを備える。加工液槽５０は、ワイヤ列２Ａの形成面の一部が浸漬される高さまで加工液３を貯留でき、仕切壁３０Ｌ，３０Ｒは、被加工物Ｗよりも上方から被加工物Ｗの切断開始端よりも下方側まで到達すると共に昇降が可能である。【選択図】図１