CHEMICAL LIQUID, AND PROCESSING METHOD

To provide a chemical liquid which is improved in etching capacity of an Al oxide, improved in suppression property of etching capacity of a Ga oxide and also improved in etching selectivity of the Ai oxide with respect to the Ga oxide, and a processing method using the chemical liquid.SOLUTION: The...

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Bibliographic Details
Main Authors SHIGENOI YUTA, MIZUTANI ATSUSHI
Format Patent
LanguageEnglish
Japanese
Published 05.04.2023
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Summary:To provide a chemical liquid which is improved in etching capacity of an Al oxide, improved in suppression property of etching capacity of a Ga oxide and also improved in etching selectivity of the Ai oxide with respect to the Ga oxide, and a processing method using the chemical liquid.SOLUTION: The present invention relates to a chemical liquid containing phosphoric acid or salt thereof, a non-protonic polar solvent, water and a compound having a carboxy group and not having a hydroxy group or salt thereof. A content of the phosphoric acid or the salt thereof is 5.0 mass% or less with respect to a total mass of the chemical liquid. A content of the non-protonic polar solvent is 50.0 mass% or more with respect to the total mass of the chemical liquid. A content of the water is 2.0 mass% or more and less than 50.0 mass% with respect to the total mass of the chemical liquid.SELECTED DRAWING: None 【課題】Al酸化物のエッチング能に優れ、Ga酸化物のエッチング能の抑制性に優れ、Ga酸化物に対するAl酸化物のエッチング選択性にも優れる薬液及び上記薬液を用いた処理方法の提供。【解決手段】リン酸又はその塩と、非プロトン性極性溶媒と、水と、カルボキシ基を有し、水酸基を有さない化合物又はその塩とを含む、薬液であって、リン酸又はその塩の含有量が、薬液の全質量に対して、5.0質量%以下であり、非プロトン性極性溶媒の含有量が、薬液の全質量に対して、50.0質量%以上であり、水の含有量が、薬液の全質量に対して、2.0質量%以上50.0質量%未満である、薬液。【選択図】なし
Bibliography:Application Number: JP20210155148