IMAGE SENSOR
To provide an image sensor that increases the size of a gate electrode and simultaneously minimizes cross-talk between pixels.SOLUTION: An image sensor 500 comprises: a substrate 1 having a first surface 1a and a second surface 1b opposite to the first surface, the substrate comprising a first pixel...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
30.03.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide an image sensor that increases the size of a gate electrode and simultaneously minimizes cross-talk between pixels.SOLUTION: An image sensor 500 comprises: a substrate 1 having a first surface 1a and a second surface 1b opposite to the first surface, the substrate comprising a first pixel and a second pixel adjacent to the first pixel: a deep device isolation portion DTI disposed in the substrate and isolating the first pixel and the second pixel from each other: a transfer gate disposed on the first surface; a ground region disposed selectively in one of the first pixel and the second pixel; and a first color filter CF1 and a micro lens array layer ML sequentially stacked on the second surface. The deep device isolation portion includes a first isolation portion 20 and a second isolation portion 30 which vertically overlap with each other and are separated from each other. The first isolation portion includes a conductive pattern 24 extending from the first surface toward the second surface; a high-concentration doped pattern 26 on the conductive pattern; and a liner insulating pattern 25 between the conductive pattern and the high-concentration doped pattern.SELECTED DRAWING: Figure 5A
【課題】ゲート電極のサイズを増加と同時にピクセル間のクロストークを最小化するイメージセンサーを提供する。【解決手段】イメージセンサー500は、第1面1aとそれに反対になる第2面1bを有し、第1ピクセル及び隣接する第2ピクセルを含む基板1、基板内に配置され、第1ピクセル及び第2ピクセルを分離する深い素子分離部DTI、第1面上に配置される伝送ゲート、第1ピクセル及び第2ピクセルの中で何れか1つに選択的に配置される接地領域、第2面上に順に積層される第1カラーフィルターCF1及びマイクロレンズアレイ層MLを含む。深い素子分離部は、垂直に重畳され、互いに離隔する第1分離部20及び第2分離部30を含む。第1分離部は、第1面から第2面に延長される導電パターン24、導電パターン上の高濃度ドーピングパターン26及び導電パターンと高濃度ドーピングパターンとの間のライナー絶縁パターン25を含む。【選択図】図5A |
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Bibliography: | Application Number: JP20220137001 |