LASER PROCESSING APPARATUS, LASER PEELING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: OKUBO TAKURO, HAYASHI HIDEKAZU
• Format: Patent
• Language: English; Japanese
• Published: 30.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To improve manufacturing efficiency of a semiconductor memory device and to improve reuse efficiency of the substrate.SOLUTION: A laser processing apparatus according to one embodiment has a stage that holds a plurality of substrates in concentric circles and rotates about the center of the concentric circles, and a laser irradiation device that has a control unit that controls output of an infrared pulse laser so that a plurality of adjacent laser spots is spaced apart and that can move in a radial direction of the concentric circles. The control unit may control the plurality of laser spots to satisfy x<L1 when a diameter of the plurality of laser spots is x and a space between the plurality of adjacent laser spots in a direction of rotation of the stage is L1.SELECTED DRAWING: Figure 4 【課題】半導体記憶装置の製造効率を向上し、且つ基板の再利用効率を向上する。【解決手段】 一実施形態にかかるレーザー加工装置は、複数の基板を同心円上に保持し、同心円の中心を軸に回転するステージと、隣接する複数のレーザースポットが離間するよう赤外パルスレーザーの出力を制御する制御部を有し、同心円の半径方向に移動可能なレーザー照射装置と、を有する。制御部は、複数のレーザースポットの直径がｘ、ステージの回転方向に隣接する複数のレーザースポットの間隔がＬ１であるとき、ｘ＜Ｌ１を満たすように制御してもよい。【選択図】 図４