LASER PROCESSING APPARATUS, LASER PEELING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
To improve manufacturing efficiency of a semiconductor memory device and to improve reuse efficiency of the substrate.SOLUTION: A laser processing apparatus according to one embodiment has a stage that holds a plurality of substrates in concentric circles and rotates about the center of the concentr...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
30.03.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To improve manufacturing efficiency of a semiconductor memory device and to improve reuse efficiency of the substrate.SOLUTION: A laser processing apparatus according to one embodiment has a stage that holds a plurality of substrates in concentric circles and rotates about the center of the concentric circles, and a laser irradiation device that has a control unit that controls output of an infrared pulse laser so that a plurality of adjacent laser spots is spaced apart and that can move in a radial direction of the concentric circles. The control unit may control the plurality of laser spots to satisfy x<L1 when a diameter of the plurality of laser spots is x and a space between the plurality of adjacent laser spots in a direction of rotation of the stage is L1.SELECTED DRAWING: Figure 4
【課題】半導体記憶装置の製造効率を向上し、且つ基板の再利用効率を向上する。【解決手段】 一実施形態にかかるレーザー加工装置は、複数の基板を同心円上に保持し、同心円の中心を軸に回転するステージと、隣接する複数のレーザースポットが離間するよう赤外パルスレーザーの出力を制御する制御部を有し、同心円の半径方向に移動可能なレーザー照射装置と、を有する。制御部は、複数のレーザースポットの直径がx、ステージの回転方向に隣接する複数のレーザースポットの間隔がL1であるとき、x<L1を満たすように制御してもよい。【選択図】 図4 |
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Bibliography: | Application Number: JP20210152673 |