THERMALLY CONDUCTIVE SILICONE COMPOSITION

• Main Author: TAMAI TOMOHIRO
• Format: Patent
• Language: English; Japanese
• Published: 30.03.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a thermally conductive silicone composition which comprises a filler in a high content, has a low viscosity before curing and achieves high adhesive strength after the curing.SOLUTION: There is provided a thermally conductive silicone composition which comprises (A) an organopolysiloxane having two or more silicon atom-bonded alkenyl groups, (B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms, (C) 85 to 95 mass% of a thermally conductive filler based on the total mass of the composition, (D) a platinum-group metal-based catalyst: the amount of the platinum group metal elements is 50 pts.mass or more based on the total 1000000 pts.mass of the components (A) and (B), (E) 0.3 to 1 pt.mass of a curing inhibitor having a specific structure based on the total 100 pts.mass of the components (A) and (B), and (F) 5 to 20 pts.mas of a polysiloxane having a structural unit of the formula, (MeViSiO2/2) and a silicon atom-bonded alkoxy group and an epoxy group-containing organic group based on the total 100 pts.mass of the components (A) and (B).SELECTED DRAWING: None 【課題】 高含有量で充填剤を含み、硬化前に粘度が低く、硬化後に高い接着強度を達成する熱伝導性シリコーン組成物を提供する。【解決手段】熱伝導性シリコーン組成物は、（Ａ）ケイ素原子結合アルケニル基を２個以上有するオルガノポリシロキサン、（Ｂ）ケイ素原子結合水素原子を２個以上有するオルガノハイドロジェンポリシロキサン、（Ｃ）熱伝導性充填剤：組成物の全質量を基準に８５～９５質量％、（Ｄ）白金族金属系触媒：（Ａ）および（Ｂ）成分の合計量１００万質量部に対して、白金族金属元素が５０質量部以上、 (Ｅ) 特定の構造を有する硬化抑制剤：（Ａ）および（Ｂ）成分の合計量１００質量部に対して０．３～１質量部、並びに（Ｆ）（ＭｅＶｉＳｉＯ２/２）の構造単位、ケイ素原子結合アルコキシ基およびエポキシ基含有有機基を有するポリシロキサン：（Ａ）および（Ｂ）成分の合計量１００質量部に対して５～２０質量部を含む。【選択図】なし