ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
To provide an organometallic adduct compound and a method of manufacturing an integrated circuit device by using the same.SOLUTION: The invention provides an organometallic adduct compound of the general formula in the figure. In the formula, R1, R2, R3, R4 and R5 are each independently a hydrogen a...
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Main Authors | , , , , , , , , , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
28.03.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide an organometallic adduct compound and a method of manufacturing an integrated circuit device by using the same.SOLUTION: The invention provides an organometallic adduct compound of the general formula in the figure. In the formula, R1, R2, R3, R4 and R5 are each independently a hydrogen atom, a halogen atom, a substituted or unsubstituted C1-C5 linear alkyl group, a substituted or unsubstituted C3-C5 branched alkyl group, a substituted or unsubstituted C2-C5 linear alkenyl group, or a substituted or unsubstituted C3-C5 branched alkenyl group; X is a halogen atom; and M is a niobium atom or a tantalum atom.SELECTED DRAWING: Figure 1
【課題】有機金属付加化合物及びそれを用いた集積回路素子の製造方法を提供する。【解決手段】下記一般式の有機金属付加化合物。TIFF2023043193000048.tif48170式中、R1、R2、R3、R4、及びR5は、それぞれ独立して水素原子、ハロゲン原子、置換または非置換のC1-C5の直鎖状アルキル基、置換または非置換のC3-C5の分岐状アルキル基、置換または非置換のC2-C5の直鎖状アルケニル基、または置換または非置換のC3-C5の分岐状アルケニル基であり、Xは、ハロゲン原子であり、Mは、ニオブ原子またはタンタル原子である。【選択図】図1 |
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Bibliography: | Application Number: JP20220147469 |