WAFER PROCESSING APPARATUS INCLUDING EFEM, AND WAFER PROCESSING METHOD

To provide a wafer processing apparatus including an EFEM, and a wafer processing method.SOLUTION: A wafer processing apparatus includes a plurality of EFEMs, a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the EFEMs includes an EFEM chamber, a plurality of lo...

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Bibliographic Details
Main Authors SONG MYUNGKI, CHOI JIN-HYUK, HWANG BEOMSOO, SEO JONGHWI, LEE KONGWOO, LEE KYUSANG, KIM KUN WOO
Format Patent
LanguageEnglish
Japanese
Published 23.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a wafer processing apparatus including an EFEM, and a wafer processing method.SOLUTION: A wafer processing apparatus includes a plurality of EFEMs, a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the EFEMs includes an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to vertically overlap at least any one of the load ports.SELECTED DRAWING: Figure 1 【課題】ＥＦＥＭを含むウェーハ処理装置及びウェーハ処理方法を提供する。【解決手段】複数のＥＦＥＭ、ウェーハ移送チャンバ、ウェーハ処理チャンバ及びウェーハ移送アームを含む。また、複数のＥＦＥＭそれぞれは、ＥＦＥＭチャンバ、ＥＦＥＭチャンバの側部に配された複数のロードポート、及び複数のロードポートのうち少なくともいずれか一つと垂直方向に重畳されるように、ＥＦＥＭチャンバの側部に配されたロードロックを含むウェーハ処理装置である。【選択図】図１
Bibliography:Application Number: JP20220098601