POLYIMIDE RESIN, RESIN COMPOSITION CONTAINING THE POLYIMIDE RESIN AND CURED PRODUCT OF THE SAME

• Main Authors: NISHIMURA KENGO, NAGASHIMA NORIYUKI, TANAKA RYUTARO, SASAKI TOMOE
• Format: Patent
• Language: English; Japanese
• Published: 20.03.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a resin material which has a novel structure and can suitably be used for a printed-wiring board, and a resin composition which contains the resin material, and of which the cured product is excellent in adhesiveness to a metal foil with low roughness and to a base material, mechanical property, heat resistance, lamination property, and dielectric property.SOLUTION: Provided is a polyimide resin which is a reaction product of an imidization product (P) of a polyamic acid resin being a copolymer of amino compounds (A) including a 6-36C aliphatic diamino compound (a1) and an aromatic diamino compound (a2) with no phenolic hydroxy group and a tetrabasic acid dianhydride (B), and a compound (C) having a functional group capable of reacting with a terminal functional group of the imidization product (P) and an ethylenically unsaturated double bond group.SELECTED DRAWING: None 【課題】プリント配線板に好適に用い得る新規構造の樹脂材料、及び該樹脂材料を含有し、その硬化物は粗度の低い金属箔および基材に対する接着性、機械特性、耐熱性、ラミネート性、誘電特性に優れる樹脂組成物を提供すること。【解決手段】炭素数６乃至３６の脂肪族ジアミノ化合物（ａ１）及びフェノール性水酸基を有さない芳香族ジアミノ化合物（ａ２）を含むアミノ化合物（Ａ）と四塩基酸二無水物（Ｂ）との共重合物であるポリアミック酸樹脂のイミド化物（Ｐ）と、イミド化物（Ｐ）の末端官能基と反応し得る官能基とエチレン性不飽和二重結合基を有する化合物（Ｃ）との反応物であるポリイミド樹脂。【選択図】なし