SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

• Main Author: IMAIZUMI NORIHISA
• Format: Patent
• Language: English; Japanese
• Published: 15.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To suppress increase in a manufacturing process.SOLUTION: A semiconductor package includes a semiconductor chip 20 formed with a semiconductor element, an insulating/heat dissipating member 10 mounted with a semiconductor chip 10, and a sealing member 30 for sealing the semiconductor chip 20. The sealing member 30 has a resin part 31 composed of a liquid crystal polymer, and a wiring part 32 electrically connected to the semiconductor chip 20, the wiring part 32 has a plurality of wiring layers 322 extending in a surface direction of the semiconductor chip 20, and a connection via 321 which extends in a lamination direction of the semiconductor chip 20 and the insulating/heat dissipating member 10 and connects the adjacent wiring layer 322 in the lamination direction, and the wiring layer 322 and the connection via 321 are composed of a sintered body.SELECTED DRAWING: Figure 1 【課題】製造工程が増加することを抑制する。【解決手段】半導体素子が形成された半導体チップ２０と、半導体チップ１０を搭載する絶縁放熱部材１０と、半導体チップ２０を封止する封止部材３０とを備える。封止部材３０は、液晶ポリマで構成された樹脂部３１と、半導体チップ２０と電気的に接続される配線部３２とを有し、配線部３２は、半導体チップ２０の面方向に沿って延びる複数の配線層３２２と、半導体チップ２０と絶縁放熱部材１０との積層方向に沿って延び、積層方向に沿って隣合う配線層３２２を接続する接続ビア３２１とを有し、配線層３２２および接続ビア３２１は、焼結体で構成されるようにする。【選択図】図１