HEAT SEALABLE AQUEOUS RESIN COMPOSITION, MEMBRANE, LAMINATE AND METHOD FOR PRODUCING THE SAME

To provide a heat sealable aqueous resin composition which exhibits good low temperature heat sealability while adopting a production method and a composition that are reduced in an influence on environment, a membrane, a laminate and a method for producing the same.SOLUTION: A heat sealable aqueous...

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Bibliographic Details
Main Authors KURODA KAITO, OKADA KEISUKE, SATO TERUAKI, MATSUMOTO MAYU
Format Patent
LanguageEnglish
Japanese
Published 14.03.2023
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Summary:To provide a heat sealable aqueous resin composition which exhibits good low temperature heat sealability while adopting a production method and a composition that are reduced in an influence on environment, a membrane, a laminate and a method for producing the same.SOLUTION: A heat sealable aqueous resin composition contains a rosin-based resin (A), a biodegradable resin (B) containing a resin having a structure of general formula (1) and/or a resin (b1) having a structure of general formula (2), and polyvinyl alcohol (C) having an average saponification degree of 75 mol% or more and 85 mol% or less, wherein a content of the component (b1) is more than 50 mass% when the total content of the component (A) and the component (B) is 100 mass%. General formula (1): -O-(CH2)x-O-CO-(CH2)y-CO-. In the general formula (1), x and y may be different, and are integers of 1 or more and 10 or less. General formula (2): -O-(CH2)z-CO-. In the general formula (2), z is an integer of 3 or more and 10 or less.SELECTED DRAWING: None 【課題】本開示で解決しようとする課題は、環境への影響を低減した製造方法及び組成を採用しつつ、良好な低温ヒートシール性を示すヒートシール性水系樹脂組成物、膜、積層体及びその製造方法を提供することである。【解決手段】本開示で提供する解決手段は、ロジン系樹脂(A)、一般式(1)の構造を有する樹脂及び/又は一般式(2)の構造を有する樹脂(b1)を含む生分解性樹脂(B)及び、平均けん化度75mol%以上85mol%以下のポリビニルアルコール(C)を含み、(b1)成分の含有量が、(A)成分及び(B)成分の合計含有量を100質量%とした場合、50質量%超である、ヒートシール性水系樹脂組成物である。一般式(1):-O-(CH2)x-O-CO-(CH2)y-CO-(一般式(1)中、x及びyはそれぞれ異なっていてもよく、1以上10以下の整数である。)一般式(2):-O-(CH2)z-CO-(一般式(2)中、zは3以上10以下の整数である。)【選択図】なし
Bibliography:Application Number: JP20220133712