METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

To provide a method for manufacturing a semiconductor device capable of suppressing warpage of a support medium.SOLUTION: A method for manufacturing a semiconductor device according to an embodiment includes providing a semiconductor chip on a first surface of a support medium having a first surface...

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Bibliographic Details
Main Author TAKANO EIJI
Format Patent
LanguageEnglish
Japanese
Published 13.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a method for manufacturing a semiconductor device capable of suppressing warpage of a support medium.SOLUTION: A method for manufacturing a semiconductor device according to an embodiment includes providing a semiconductor chip on a first surface of a support medium having a first surface and a second surface on the opposite side of the first surface, forming a first resin layer covering the semiconductor chip on the first surface, and forming a second resin layer on the second surface.SELECTED DRAWING: Figure 2D 【課題】支持体の反りを抑制することができる半導体装置の製造方法を提供する。【解決手段】本実施形態による半導体装置の製造方法は、第１面と、第１面とは反対側の第２面と、を有する支持体の第１面上に半導体チップを設けることを具備する。第１面上に、半導体チップを覆う第１樹脂層を形成するとともに、第２面上に第２樹脂層を形成する。【選択図】図２Ｄ
Bibliography:Application Number: JP20210142606