SUBSTRATE PROCESSING METHOD

• Main Authors: HONGO TOMOYUKI, UCHIHO TAKASHI, YOSHIKAWA TOSHIYUKI, TSUCHIYA TOSHIO, SAITO YOSHINOBU
• Format: Patent
• Language: English; Japanese
• Published: 13.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a substrate processing method capable of preventing deposition of processing waste on a device when separating a recess and a projection of a substrate.SOLUTION: A substrate processing method is a method for separating a circular recess and a ring-shaped annular projection of a substrate having the circular recess and the annular projection surrounding the circular recess formed on the back surface thereof, and includes a processed groove forming step 1002 of irradiating the outer edge of the circular recess, which is the boundary between the circular recess and the annular projection, with a laser beam to form a processed groove that does not completely cut the substrate along the outer edge of the circular recess, and a separation step 1003 of irradiating the bottom surface of the processed groove with a laser beam to form a separation groove in the processed groove for completely separating the circular recess and the annular projection.SELECTED DRAWING: Figure 3 【課題】基板の凸部と凹部とを分離する際にデバイスへの加工屑の堆積を防止できる基板の加工方法を提供すること。【解決手段】基板の加工方法は、裏面に円形凹部と、円形凹部を囲繞するリング状の環状凸部と、が形成された基板の環状凸部と円形凹部とを分離する方法であって、円形凹部と環状凸部との境界部である円形凹部の外縁部にレーザ光線を照射し円形凹部の外縁部に沿って基板を完全に切断しない加工溝を形成する加工溝形成ステップ１００２と、加工溝の底面にレーザ光線を照射し、加工溝に円形凹部と環状凸部とを完全に分離する分離溝を形成する分離ステップ１００３とを備える。【選択図】図３