POWER CONVERSION DEVICE

To reduce the manufacturing cost of a power conversion device in which a power conversion circuit and a reactor are mounted on the same substrate.SOLUTION: A power conversion device 100 includes a converter circuit 110 having a power semiconductor, an inverter circuit 130 having a power semiconducto...

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Bibliographic Details
Main Authors FUJIWARA MASAHIDE, OGURI AKIHIKO, OSHITA KAZUHIRO, YAMANE YUKIHIDE, MAMMOTO KAZUKI
Format Patent
LanguageEnglish
Japanese
Published 13.03.2023
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Summary:To reduce the manufacturing cost of a power conversion device in which a power conversion circuit and a reactor are mounted on the same substrate.SOLUTION: A power conversion device 100 includes a converter circuit 110 having a power semiconductor, an inverter circuit 130 having a power semiconductor, a reactor 121, and a printed circuit board 71. The reactor 121 has a core 201 and winding 202. The converter circuit 110, the inverter circuit 130, and the reactor 121 are mounted on the same printed circuit board 71. Of the winding 202 of the reactor 121, a wire wound around the core 201 is made of a material whose electrical resistivity (Ω m) at 20°C is higher than that of copper.SELECTED DRAWING: Figure 4 【課題】電力変換回路とリアクトルとを同一の基板に実装する電力変換装置の製造コストを抑える。【解決手段】電力変換装置100は、パワー半導体を有するコンバータ回路110及びインバータ回路130と、リアクトル121と、プリント基板71とを備えている。リアクトル121は、コア201と巻線202とを有する。コンバータ回路110及びインバータ回路130とリアクトル121とは、同一のプリント基板71に実装されている。リアクトル121の巻線202のうち、コア201に巻きつけられる線は、20℃における電気抵抗率(Ω・m)が銅よりも高い物質から成る線である。【選択図】図4
Bibliography:Application Number: JP20210141344