RESIN CURED PRODUCT AND ELECTRONIC COMPONENT DEVICE

• Main Authors: OSHITA TAKESHI, KANG DONGOL, INOUE YUKIKO
• Format: Patent
• Language: English; Japanese
• Published: 13.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a resin cured product which is excellent in reflow resistance.SOLUTION: A resin cured product has storage elastic modulus at 260°C determined by dynamic viscoelasticity measurement of 1,500 MPa or less, wherein tanδ determined by dynamic viscoelasticity measurement has at least two peaks, and a peak temperature of a peak at the highest temperature side among the peaks of the tanδ is within the range of 190°C-300°C.SELECTED DRAWING: None 【課題】耐リフロー性に優れる樹脂硬化物の提供。【解決手段】樹脂硬化物は、動的粘弾性測定により求められた２６０℃における貯蔵粘弾性が、１５００ＭＰａ以下であり、動的粘弾性測定により求められたｔａｎδが、少なくとも２つのピークを有し、前記ｔａｎδのピークのうちの最も高温側のピークのピーク温度が、１９０℃～３００℃の範囲に存在するものである。【選択図】なし