COPPER-BASED ALLOY SPUTTERING TARGET AND METHOD FOR MAKING THE SAME

• Main Authors: YE YU-AN, HSIEH TSUNG-HSIEN, LIN SHOU-HSIEN
• Format: Patent
• Language: English; Japanese
• Published: 09.03.2023
• Subjects: ALLOYS; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF ALLOYS OR NON-FERROUS METALS

To provide an integrated copper-based alloy sputtering target.SOLUTION: A copper-based alloy sputtering target includes copper and at least one kind of other predetermined metal element selected from the group consisting of Mn, Cr, Co, Al, Sn, and Ti. On the basis of 100 wt.% of the total amount of the copper and at least one kind of the other predetermined metal element, the copper-based alloy sputtering target has a content of copper of 98 wt.% or more and a content of the other predetermined metal element in the range of 0.3 wt.%-2 wt.%. The target has an average value of Kernel Average Misorientation of 2 degrees or less as measured by Electron Backscatter Diffraction and an average value of a Vickers hardness on an erosion surface in the range of 90 Hv-120 Hv.SELECTED DRAWING: Figure 1 【課題】一体型の銅合金スパッタリングターゲットを提供する。【解決手段】銅と、Ｍｎ、Ｃｒ、Ｃｏ、Ａｌ、Ｓｎ、Ｔｉからなる群より選ばれる少なくとも１種の他の所定の金属元素と、を含み、総量を１００ｗｔ％として、前記銅の含有量は、９８ｗｔ％以上にあり、前記他の所定の金属元素の含有量は、０．３ｗｔ％～２ｗｔ％の範囲内にあり、電子線後方散乱回折器により測定されたカーネル平均方位差の平均値は、２度以下にあり、また、９０Ｈｖ～１２０Ｈｖの範囲内の平均ビッカース硬度を有するエロージョン面を備える。【選択図】図１