LOW DIELECTRIC ADHESIVE COMPOSITION

• Main Authors: TORII MASAHIRO, ISHIHARA TOSHIHISA, OKIMURA YUYA, HIRAKAWA MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 09.03.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

To provide a low dielectric adhesive composition having low dielectricity and superior adhesion, and also excelling at hygrothermal solder heat resistance and laser processability.SOLUTION: An adhesive composition contains styrenic elastomer (A), an alicyclic skeleton-containing resin that contains an alicyclic skeleton of a specific structure (B), and epoxy resin (C). The cured product of the adhesive composition has a dielectric constant of less than 2.5.SELECTED DRAWING: None 【課題】誘電性が低く、接着性が良好なだけでなく、湿熱はんだ耐熱性やレーザー加工性にも優れた低誘電性接着剤組成物を提供する。【解決手段】スチレン系エラストマー（Ａ）と、特定構造の脂環式骨格を含有する脂環式骨格含有樹脂（Ｂ）と、エポキシ樹脂（Ｃ）とを含有し、硬化物の誘電率が、２．５未満であることを特徴とする接着剤組成物。【選択図】なし