POLYMER COMPOUND AND METHOD FOR PRODUCING THE SAME, COMPOSITION AND METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITION

To provide a polymer compound which has a large content of a branched polymer and has a high degree of branch of the branched polymer, and a method for producing the same.SOLUTION: There is provided a polymer compound in which a plurality of polymer chains are connected to each other with a di- or h...

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Bibliographic Details
Main Authors DING RENPING, CHATANI SHUNSUKE
Format Patent
LanguageEnglish
Japanese
Published 09.03.2023
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Summary:To provide a polymer compound which has a large content of a branched polymer and has a high degree of branch of the branched polymer, and a method for producing the same.SOLUTION: There is provided a polymer compound in which a plurality of polymer chains are connected to each other with a di- or higher valent connection group, wherein the di- or higher valent connection group has either or both of a thiol group and a thioether structure, a ratio (absolute Mw/relative Mw) of an absolute weight average molecular weight (absolute Mw) to a relative weight average molecular weight (relative Mw) is 1.25 or more, when the di- or higher valent connection group has a thiol group, a value of an acid dissociation constant pKa of the thiol group to water of the di- or higher valent connection group is 8.0 or less, when the di- or higher valent connection group has a thioether structure and the di- or higher valent connection group has two or more thioether groups, a smallest distance between sulfur atoms of the thioether structure is 300 or more in terms of molecular weight.SELECTED DRAWING: None 【課題】分岐ポリマーの含有量が多く、前記分岐ポリマーの分岐度が高い高分子化合物及びその製造方法を提供する。【解決手段】複数のポリマー鎖が2価以上の連結基で連結された高分子化合物であって、前記2価以上の連結基はチオール基及びチオエーテル構造のいずれか一方又は両方を有し、相対重量平均分子量(相対Mw)に対する絶対重量平均分子量(絶対Mw)の比(絶対Mw/相対Mw)が1.25以上であり、前記2価以上の連結基がチオール基を有する場合、前記2価以上の連結基のチオール基の水に対する酸解離定数pKaの値が8.0以下であり、前記2価以上の連結基がチオエーテル構造を有する場合であって、前記前記2価以上の連結基がチオエーテル構造を2つ以上有するとき、前記チオエーテル構造のイオウ原子間の最も小さい距離が分子量換算で300以上である、高分子化合物。【選択図】なし
Bibliography:Application Number: JP20210138088