SHOCK ABSORBING STRUCTURE

To provide a shock absorbing structure having an enhanced component protection property while suppressing increase in size of a mounted device.SOLUTION: A circuit board 13 on which electronic components are mounted is housed in a housing 12. A holding member 11 is housed in the housing 12 and has lo...

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Bibliographic Details
Main Authors SANO TAKUMA, ISHIKAWA TOMOHIRO, YUGAWA HIDENORI, MORISHITA KENSUKE
Format Patent
LanguageEnglish
Japanese
Published 16.02.2023
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Summary:To provide a shock absorbing structure having an enhanced component protection property while suppressing increase in size of a mounted device.SOLUTION: A circuit board 13 on which electronic components are mounted is housed in a housing 12. A holding member 11 is housed in the housing 12 and has lower rigidity than the housing 12. The holding member 11 includes a pillar section 112 and a beam section 113. An upper end 112a and a lower end 112b of the pillar section 112 are brought into contact with the housing 12. The beam section 113 extends in a cantilever state from the pillar section 112 and holds the circuit board 13.SELECTED DRAWING: Figure 3 【課題】搭載される装置の大型化を抑制しつつ部品保護能力を高めた衝撃吸収構造を提供する。【解決手段】電子部品が搭載されている回路基板13は、筐体12に収容されている。保持部材11は、筐体12に収容されており、筐体12よりも低い剛性を有している。保持部材11は、柱部112と梁部113を備えている。柱部112の上端部112aと下端部112bは、筐体12に接している。梁部113は、柱部112から片持ち梁状に延びており、回路基板13を保持している。【選択図】図3
Bibliography:Application Number: JP20210129945