SUBSTRATE WATER VAPOR PROCESSING METHOD AND SUBSTRATE WATER VAPOR PROCESSING SYSTEM

• Main Authors: YASUTOMO ATSUSHI, ITO TAKESHI, WAKABAYASHI TAKANORI
• Format: Patent
• Language: English; Japanese
• Published: 16.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a technology capable of more stably performing processing on a substrate using water vapor.SOLUTION: A substrate water vapor processing method performs processing on a substrate using water vapor in a processing container. To the processing container, a supply unit including at least a water storage tank and a vaporizer and a discharge unit including at least a gas-liquid separation unit are connected. The substrate water vapor processing method includes: a pooling step of storing liquid water in the water storage tank; a gas removing step of removing gas in a transfer path; a water vapor generation step of generating water vapor using the vaporizer; and a water vapor processing step of performing processing on the substrate using water vapor. The substrate water vapor processing method further includes: a discharge separation step of separating a discharge discharged from the processing container into discharge gas and discharge liquid; and a discharge gas discharge liquid discharging step of separately discharging the discharge gas and the discharge liquid.SELECTED DRAWING: Figure 1 【課題】水蒸気による基板の処理を一層安定的に行うことができる技術を提供する。【解決手段】基板水蒸気処理方法は、処理容器にて水蒸気による処理を基板に施す。処理容器には、少なくとも貯水タンクと気化器とを含む供給部、および少なくとも気液分離部を含む排出部が接続される。基板水蒸気処理方法は、貯水タンクに液水を貯水する貯留工程と、移送経路の気体を除去する気体除去工程と、気化器で水蒸気を生成する水蒸気生成工程と、基板に対して水蒸気による処理を施す水蒸気処理工程と、を有する。また、基板水蒸気処理方法は、処理容器から排出される排出物を排ガスと排液とに分離する排出物分離工程と、排ガスおよび排液を別々に排出する排ガス排液排出工程と、を有する。【選択図】図１