LIGHT EMISSION DEVICE AND MANUFACTURING METHOD OF LIGHT EMISSION DEVICE

• Main Author: TANABE MAIKO
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a light emission device which suppresses light leakage due to sag of an adhesive resin to a light emission element side surface and creep-up to a wavelength conversion body side surface, and a manufacturing method of the same.SOLUTION: A light emission device 100 comprises: a mounting substrate 10; a light emission element 20 which has a support substrate 21, a functional layer 23 including a light emission layer formed on the support substrate 21, and an electrode pad 25 apart from the functional layer 23 at an end on the end of the support substrate 21; a wavelength conversion body 30 which covers the upper surface of the light emission functional layer 23 via a resin part 50 on the light emission element; and a light reflection body which covers the side surface of the light emission element 20 and the side surface of the wavelength conversion body 30. The wavelength conversion body 30 comprises: a first side surface portion which extends in a vertical direction from an outer edge of a bottom surface opposing the light emission functional layer 23 on the side surface on the side of the electrode pad 25; and a second side surface portion which extends inward from the upper end of the first side surface portion to reach the outer edge of the upper surface. The resin part 50 is formed so as to cover a gap between the light emission functional layer 23 and the electrode pad 25, a portion on the electrode pad 25, and the first side surface portion.SELECTED DRAWING: Figure 1 【課題】接着樹脂の発光素子側面への垂れ及び波長変換体側面への這い上がりによる光漏れ抑制を抑制した発光装置及びその製造方法を提供する。【解決手段】発光装置１００は、搭載基板１０と、支持基板２１、支持基板２１上に形成された発光層を含む機能層２３、及び支持基板上２１の端部に機能層２３と離間した電極パッド２５を有し、発光素子２０上に樹脂部５０を介して発光機能層２３の上面を覆う波長変換体３０と、発光素子２０の側面及び波長変換体３０の側面を覆う光反射体と、を含み、波長変換体３０は、電極パッド２５の側の側面に発光機能層２３と対向する底面の外縁から垂直方向に延伸する第１の側面部分と、前記第１の側面部分の上端から内方に延伸し上面の外縁に達する第２の側面部分と、を有し、樹脂部５０は発光機能層２３と電極パッド２５との間隙、電極パッド２５上の一部、及び第１の側面部分を覆うよう形成。【選択図】図１