SUPPORT UNIT AND SUBSTRATE PROCESSING DEVICE INCLUDING THE SAME

• Main Authors: AHN HEE MAN, KIM KANG SUL
• Format: Patent
• Language: English; Japanese
• Published: 31.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a support unit and a substrate processing device including the same that can minimize the influence of an external air current.SOLUTION: The present invention provides a device that processes a substrate. The device for processing the substrate includes a processing container having a processing space therein, a support unit that supports and rotates the substrate in the processing space, and a liquid supply unit that supplies liquid onto the substrate, the support unit includes a body on which the substrate is seated and a support shaft coupled with the body, and the top surface of the body is provided with a center portion including the center of the body and edges surrounding the center portion, a vacuum hole may be formed in the center and a groove may be formed in the edge.SELECTED DRAWING: Figure 8 【課題】外部気流の影響を最小化することができる支持ユニット及びこれを含む基板処理装置を提供する。【解決手段】本発明は基板を処理する装置を提供する。基板を処理する装置は内部に処理空間を有する処理容器、前記処理空間で前記基板を支持し、回転させる支持ユニット、及び前記基板上に液を供給する液供給ユニットを含み、前記支持ユニットは基板が安着される本体及び前記本体と結合される支持軸含み、前記本体の上部面には前記本体の中心を含む中央部と前記中央部を囲む縁部が提供され、前記中央部には真空ホールが形成され、前記縁部には溝が形成されることができる。【選択図】図８