CURABLE RESIN COMPOSITION

• Main Authors: YAMAMOTO HISANAO, IWASE KATSUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 26.01.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a curable resin composition containing terminal-modified polyphenylene ether having a vinylsilyl group at a terminal, and a crosslinking auxiliary which enables production of a uniform cured product and satisfies all of a sufficient Tg, low dielectric characteristics, copper foil adhesion and a low coefficient of liner expansion of the cured product.SOLUTION: A curable resin composition contains (A) modified polyphenylene ether represented by formula (1), and (B) an aliphatic maleimide compound having a molecular weight of 2,000 or less, as a crosslinking auxiliary. In the formula (1), Z is an a-valent partial structure, a represents an integer of 2 to 6, Y are each independently a divalent connection group, n represent a repeated number of Y and are each independently an integer of 0 to 200, at least one n in a pieces of (-Yn-A) is an integer of 1 or more, and A represents a hydrogen atom or a silyl group-containing derivative bondable to a polyphenylene ether structure, excluding the case of all the hydrogen atoms.SELECTED DRAWING: None 【課題】末端にビニルシリル基を有する末端変性ポリフェニレンエーテルと、架橋助剤を含んだ硬化性樹脂組成物で、均一な硬化物が得られ、硬化物の十分なＴｇ、低誘電特性、銅箔接着性、及び低線膨張係数の全てを満足させる硬化性樹脂組成物を提供すること。【解決手段】（Ａ）式（１）で表される変性ポリフェニレンエーテル、及び（Ｂ）架橋助剤である、分子量２０００以下の脂肪族マレイミド化合物を含む、硬化性樹脂組成物。TIFF2023013860000053.tif1678式（１）中、Ｚは、ａ価の部分構造であり、ａは２～６の整数を表し、Ｙは、各々独立に、２価の連結基であり、ｎは、Ｙの繰り返し数を表し、各々独立に、０～２００の整数であり、ａ個の（－Ｙｎ－Ａ）中の少なくとも１つのｎは、１以上の整数であり、Ａは、全て水素原子の場合を除いて、水素原子、又はポリフェニレンエーテル構造と結合可能なシリル基含有誘導体を表す。【選択図】なし