THERMOSETTING RESIN COMPOSITION, RESIN SHEET, METAL BASE BOARD, AND ELECTRONIC DEVICE

• Main Authors: OBA AKIYOSHI, KASHINO TOMOMASA
• Format: Patent
• Language: English; Japanese
• Published: 20.01.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a thermosetting resin composition which is usable for manufacturing a thermally conductive sheet having high thermal conductivity.SOLUTION: A thermosetting resin composition contains (A) an epoxy resin, (B) a thermosetting resin (excluding the epoxy resin (A), (C) a phenoxy resin, and (D) a thermally conductive filler, where the phenoxy resin (C) is a phenoxy resin obtained by reacting a bifunctional epoxy compound (c1) having two epoxy groups, a polyfunctional epoxy compound (c2) having three or more epoxy groups, and a polyfunctional phenol compound (c3) having at least two phenolic hydroxyl groups.SELECTED DRAWING: None 【課題】高い熱伝導性を有する熱伝導性シートを製造するために用いることができる熱硬化性樹脂組成物を提供する。【解決手段】（Ａ）エポキシ樹脂と、（Ｂ）熱硬化性樹脂（前記エポキシ樹脂（Ａ）を除く）と、（Ｃ）フェノキシ樹脂と、（Ｄ）熱伝導性フィラーと、を含む熱硬化性樹脂組成物であって、前記フェノキシ樹脂（Ｃ）は、２つのエポキシ基を有する２官能エポキシ化合物（ｃ１）と、３つ以上のエポキシ基を有する多官能エポキシ化合物（ｃ２）と、少なくとも２つのフェノール性水酸基を有する多官能フェノール化合物（ｃ３）とを、反応させて得られる、フェノキシ樹脂である、熱硬化性樹脂組成物。【選択図】なし