HEAT RADIATION STRUCTURE OF HEATING COMPONENT AND ASSEMBLY METHOD OF THE SAME

• Main Authors: SHIBAZAKI MAMORU, OGURA NAOTADA, KOBAYASHI SHINICHI
• Format: Patent
• Language: English; Japanese
• Published: 19.01.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a heat radiation structure of a heating component which can efficiently radiate heat of a heating component mounted on a substrate housed within a resin housing of an electronic component by utilizing the resin housing, and to provide an assembly method of the heat radiation structure of the heating component.SOLUTION: A heat radiation structure of a heating component includes a radiator 3 which contacts with a heating component 30. The radiator 3 has: a first heat transmission holding part 16 and a second heat transmission holding part 17 which contact with two facing side surfaces of the heating component 30; a main heat radiation part 5 which faces and contacts with a flat surface of the heating component 30; and a periphery heat radiation part 7 which extends outward continuously from the main heat radiation part 5. A first housing part 21, to which a substrate 35 is fixed, and a second housing part 24 which is disposed at the opposite side of the first housing part 21 through the heating component 30 and the radiator 30 are fixed to each other. The second housing part 24 contacts with the main heat radiation part 5 and the periphery heat radiation part 7 to fix the radiator 3 to the heating component 30.SELECTED DRAWING: Figure 3 【課題】電子機器の樹脂筐体の内部に収容された基板に実装される発熱部品を、樹脂筐体を利用して効率良く放熱することが可能な発熱部品の放熱構造及びその組立方法を提供すること。【解決手段】発熱部品３０に接する放熱体３を備え、放熱体３は、発熱部品３０の互いに対抗する２側面に第１の伝熱保持部１６と、第２の伝熱保持部１７と、発熱部品３０の平面に対向して接する主放熱部５と、当該主放熱部５から連続して外側に延伸した周辺放熱部７とを有しており、基板３５が固定される第１の筐体部２１と発熱部品３０及び放熱体３０を介して第１の筐体部２１と反対側に配される第２の筐体部２４とが互いに固定されて、第２の筐体部２４が主放熱部５及び周辺放熱部７に接触して当該放熱体３を発熱部品３０に固定しているものである。【選択図】図３